Prediction of Real Contact Area from Microtopography on CMP Pad

A simplified model related to microtopography on CMP pad and prediction of real contact area between the pad and wafers is presented in this paper. The model has been developed on the basis of the analysis of the pad surface roughness and contact mechanics. The bearing area curve, representing tribo...

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Bibliographic Details
Main Authors: Hobin JEONG, Hyunseop LEE, Sungha CHOI, Youngkyun LEE, Haedo JEONG
Format: Article
Language:English
Published: The Japan Society of Mechanical Engineers 2012-01-01
Series:Journal of Advanced Mechanical Design, Systems, and Manufacturing
Subjects:
Online Access:https://www.jstage.jst.go.jp/article/jamdsm/6/1/6_1_113/_pdf/-char/en