Prediction of Real Contact Area from Microtopography on CMP Pad
A simplified model related to microtopography on CMP pad and prediction of real contact area between the pad and wafers is presented in this paper. The model has been developed on the basis of the analysis of the pad surface roughness and contact mechanics. The bearing area curve, representing tribo...
Main Authors: | , , , , |
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Format: | Article |
Language: | English |
Published: |
The Japan Society of Mechanical Engineers
2012-01-01
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Series: | Journal of Advanced Mechanical Design, Systems, and Manufacturing |
Subjects: | |
Online Access: | https://www.jstage.jst.go.jp/article/jamdsm/6/1/6_1_113/_pdf/-char/en |