Overcoming Chip Shortages: Low-Cost Open-Source Parametric 3-D Printable Solderless SOIC to DIP Breakout Adapters
The COVID-19 pandemic exposed the vulnerability of global supply chains of many products. One area that requires improved supply chain resilience and that is of particular importance to electronic designers is the shortage of basic dual in-line package (DIP) electronic components commonly used for p...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2023-04-01
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| Series: | Inventions |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2411-5134/8/2/61 |