Characterization of Mechanical, Electrical and Thermal Properties of Bismaleimide Resins Based on Different Branched Structures

Bismaleimide (BMI) resin is an excellent performance resin, mainly due to its resistance to the effect of heat and its insulating properties. However, its lack of toughness as a cured product hampers its application in printed circuit boards (PCBs). Herein, a branched structure via Michael addition...

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Bibliographic Details
Main Authors: Haihui Cai, Jiahao Shi, Xiaorui Zhang, Zhou Yang, Ling Weng, Qingye Wang, Shaohui Yan, Lida Yu, Junlong Yang
Format: Article
Language:English
Published: MDPI AG 2023-01-01
Series:Polymers
Subjects:
Online Access:https://www.mdpi.com/2073-4360/15/3/592