Characterization of Mechanical, Electrical and Thermal Properties of Bismaleimide Resins Based on Different Branched Structures
Bismaleimide (BMI) resin is an excellent performance resin, mainly due to its resistance to the effect of heat and its insulating properties. However, its lack of toughness as a cured product hampers its application in printed circuit boards (PCBs). Herein, a branched structure via Michael addition...
Main Authors: | , , , , , , , , |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2023-01-01
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Series: | Polymers |
Subjects: | |
Online Access: | https://www.mdpi.com/2073-4360/15/3/592 |