Characterization of Mechanical, Electrical and Thermal Properties of Bismaleimide Resins Based on Different Branched Structures
Bismaleimide (BMI) resin is an excellent performance resin, mainly due to its resistance to the effect of heat and its insulating properties. However, its lack of toughness as a cured product hampers its application in printed circuit boards (PCBs). Herein, a branched structure via Michael addition...
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| Format: | Article |
| Language: | English |
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MDPI AG
2023-01-01
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| Series: | Polymers |
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| Online Access: | https://www.mdpi.com/2073-4360/15/3/592 |
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| author | Haihui Cai Jiahao Shi Xiaorui Zhang Zhou Yang Ling Weng Qingye Wang Shaohui Yan Lida Yu Junlong Yang |
| author_facet | Haihui Cai Jiahao Shi Xiaorui Zhang Zhou Yang Ling Weng Qingye Wang Shaohui Yan Lida Yu Junlong Yang |
| author_sort | Haihui Cai |
| collection | DOAJ |
| description | Bismaleimide (BMI) resin is an excellent performance resin, mainly due to its resistance to the effect of heat and its insulating properties. However, its lack of toughness as a cured product hampers its application in printed circuit boards (PCBs). Herein, a branched structure via Michael addition was introduced to a BMI system to reinforce its toughness. Compared with a pure BMI sample, the flexural strength of the modified BMI was enhanced, and its maximum value of 189 MPa increased by 216%. The flexural modulus of the cured sample reached 5.2 GPa. Using a scanning electron microscope, the fracture surfaces of BMI samples and a transition from brittle fracture to ductile fracture were observed. Furthermore, both the dielectric constant and the dielectric loss of the cured resin decreased. The breakdown field strength was raised to 37.8 kV/mm and the volume resistivity was improved to varying degrees. Consequently, the resulting modified BMI resin has the potential for wide application in high-frequency and low-dielectric resin substrates, and the modified BMI resin with a structure including three different diamines can meet the needs of various applications. |
| first_indexed | 2024-03-11T09:28:16Z |
| format | Article |
| id | doaj.art-56a8ddcace674c259f08ca515fd54f4f |
| institution | Directory Open Access Journal |
| issn | 2073-4360 |
| language | English |
| last_indexed | 2024-03-11T09:28:16Z |
| publishDate | 2023-01-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Polymers |
| spelling | doaj.art-56a8ddcace674c259f08ca515fd54f4f2023-11-16T17:47:45ZengMDPI AGPolymers2073-43602023-01-0115359210.3390/polym15030592Characterization of Mechanical, Electrical and Thermal Properties of Bismaleimide Resins Based on Different Branched StructuresHaihui Cai0Jiahao Shi1Xiaorui Zhang2Zhou Yang3Ling Weng4Qingye Wang5Shaohui Yan6Lida Yu7Junlong Yang8School of Materials Science and Engineering, Harbin University of Science and Technology, Harbin 150040, ChinaSchool of Materials Science and Engineering, Harbin University of Science and Technology, Harbin 150040, ChinaSchool of Materials Science and Engineering, Harbin University of Science and Technology, Harbin 150040, ChinaSchool of Materials Science and Engineering, Harbin University of Science and Technology, Harbin 150040, ChinaSchool of Materials Science and Engineering, Harbin University of Science and Technology, Harbin 150040, ChinaSchool of Materials Science and Engineering, Harbin University of Science and Technology, Harbin 150040, ChinaSchool of Materials Science and Engineering, Harbin University of Science and Technology, Harbin 150040, ChinaSchool of Materials Science and Engineering, Harbin University of Science and Technology, Harbin 150040, ChinaHarbin Electric Machinery Company Limited, Harbin 150040, ChinaBismaleimide (BMI) resin is an excellent performance resin, mainly due to its resistance to the effect of heat and its insulating properties. However, its lack of toughness as a cured product hampers its application in printed circuit boards (PCBs). Herein, a branched structure via Michael addition was introduced to a BMI system to reinforce its toughness. Compared with a pure BMI sample, the flexural strength of the modified BMI was enhanced, and its maximum value of 189 MPa increased by 216%. The flexural modulus of the cured sample reached 5.2 GPa. Using a scanning electron microscope, the fracture surfaces of BMI samples and a transition from brittle fracture to ductile fracture were observed. Furthermore, both the dielectric constant and the dielectric loss of the cured resin decreased. The breakdown field strength was raised to 37.8 kV/mm and the volume resistivity was improved to varying degrees. Consequently, the resulting modified BMI resin has the potential for wide application in high-frequency and low-dielectric resin substrates, and the modified BMI resin with a structure including three different diamines can meet the needs of various applications.https://www.mdpi.com/2073-4360/15/3/592BMI resinbranched structuretoughnessflexural moduluselectrical properties |
| spellingShingle | Haihui Cai Jiahao Shi Xiaorui Zhang Zhou Yang Ling Weng Qingye Wang Shaohui Yan Lida Yu Junlong Yang Characterization of Mechanical, Electrical and Thermal Properties of Bismaleimide Resins Based on Different Branched Structures Polymers BMI resin branched structure toughness flexural modulus electrical properties |
| title | Characterization of Mechanical, Electrical and Thermal Properties of Bismaleimide Resins Based on Different Branched Structures |
| title_full | Characterization of Mechanical, Electrical and Thermal Properties of Bismaleimide Resins Based on Different Branched Structures |
| title_fullStr | Characterization of Mechanical, Electrical and Thermal Properties of Bismaleimide Resins Based on Different Branched Structures |
| title_full_unstemmed | Characterization of Mechanical, Electrical and Thermal Properties of Bismaleimide Resins Based on Different Branched Structures |
| title_short | Characterization of Mechanical, Electrical and Thermal Properties of Bismaleimide Resins Based on Different Branched Structures |
| title_sort | characterization of mechanical electrical and thermal properties of bismaleimide resins based on different branched structures |
| topic | BMI resin branched structure toughness flexural modulus electrical properties |
| url | https://www.mdpi.com/2073-4360/15/3/592 |
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