Modelling of thermocouple geometry variations for improved heat transfer monitoring in smart electronic manufacturing environment
In this paper, the effect of different thermocouple constructions on the hot spot temperature are investigated with a modelling approach to achieve more precise soldering profile acquisition and failure analysis at different reflow soldering heat transfer methods. The paper focuses on convection-bas...
| Main Authors: | , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2022-05-01
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| Series: | Case Studies in Thermal Engineering |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2214157X22002477 |