Thermal and Moisture Dependent Material Characterization and Modeling of Glass Fiber Reinforced Epoxy Laminates
The Micro-Electro-Mechanical Semiconductor (MEMS) sensor packages are an advanced multi-material composite system. These packages comprise polymeric materials like prepregs, solder-mask, insulation, and conductive adhesives. Prepregs are glass fiber reinforced epoxy laminates. Only a low material se...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IFSA Publishing, S.L.
2021-01-01
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| Series: | Sensors & Transducers |
| Subjects: | |
| Online Access: | https://sensorsportal.com/HTML/DIGEST/january_2021/Vol_248/P_3196.pdf |