Fabrication of SiC@Cu/Cu Composites with the Addition of SiC@Cu Powder by Magnetron Sputtering
In view of the surface engineering application of electrical contact materials, SiC ceramic particles were introduced into copper matrix composites by the hot-press sintering method for the sake of enhancing the service life of copper matrix electrical contact materials. Magnetron sputtering technol...
| मुख्य लेखकों: | , , , , , , |
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| स्वरूप: | लेख |
| भाषा: | English |
| प्रकाशित: |
Wiley
2021-01-01
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| श्रृंखला: | International Journal of Photoenergy |
| ऑनलाइन पहुंच: | http://dx.doi.org/10.1155/2021/6623776 |