Automated Detection and Classification of Defective and Abnormal Dies in Wafer Images
This article presents an automated vision-based algorithm for the die-scale inspection of wafer images captured using scanning acoustic tomography (SAT). This algorithm can find defective and abnormal die-scale patterns, and produce a wafer map to visualize the distribution of defects and anomalies...
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| Format: | Article |
| Language: | English |
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MDPI AG
2020-05-01
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| Series: | Applied Sciences |
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| Online Access: | https://www.mdpi.com/2076-3417/10/10/3423 |