Using Enhanced Test Systems Based on Digital IC Test Model for the Improvement of Test Yield

In this work, we use statistical concepts to evaluate the joint probability distribution of manufacturing and test parameters and estimate the future trend of wafer test yield. Owing to the difference between the development speeds of testing technology and manufacturing technology, the testing capa...

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Bibliographic Details
Main Authors: Chung-Huang Yeh, Jwu-E Chen, Chia-Jui Chang, Tse-Chia Huang
Format: Article
Language:English
Published: MDPI AG 2022-03-01
Series:Electronics
Subjects:
Online Access:https://www.mdpi.com/2079-9292/11/7/1115