Analysis of Degradation of Electromigration Reliability of Au-Al and OPM Wire Bonded Contacts at 250 °C Using Resistance Monitoring Method

Analysis of Degradation of Electromigration Reliability of Au-Al and OPM Wire Bonded Contacts at 250 °C Using Resistance Monitoring Method

The ongoing trend towards miniaturization and increased packaging density has exacerbated the reliability problem of Au-Al heterogeneous metal bonding structures in high-temperature environments, where extreme temperatures and high current pose a serious challenge. In order to address this issue, th...

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Bibliographic Details
Main Authors: Xueqin Li, Linchun Gao, Tao Ni, Jingnan Zhou, Xiaojing Li, Yifan Li, Lida Xu, Runjian Wang, Chuanbin Zeng, Bo Li, Jiajun Luo, Jing Li
Format: Article
Language:English
Published: MDPI AG 2023-03-01
Series:Micromachines
Subjects:
Au-Al wire bonding
OPM structure
electromigration reliability
high temperature
Online Access:https://www.mdpi.com/2072-666X/14/3/640

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https://www.mdpi.com/2072-666X/14/3/640

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