Study of Thermal Stress Fluctuations at the Die-Attach Solder Interface Using the Finite Element Method
Solder joints in electronic packages are frequently exposed to thermal cycling in both real-life applications and accelerated thermal cycling tests. Cyclic temperature leads the solder joints to be subjected to cyclic mechanical loading and often accelerates the cracking failure of the solder joints...
| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2021-12-01
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| Series: | Electronics |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2079-9292/11/1/62 |