An Anisotropic Equivalent Thermal Model for Shield Differential Through-Silicon Vias

An Anisotropic Equivalent Thermal Model for Shield Differential Through-Silicon Vias

An accurate equivalent thermal model is proposed to calculate the equivalent thermal conductivity (ETC) of shield differential through-silicon via (SDTSV). The mathematical expressions of ETC in both horizontal and vertical directions are deduced by considering the anisotropy of SDTSV. The accuracy...

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Bibliographic Details
Main Authors: Guangbao Shan, Guoliang Li, Dongdong Chen, Zifeng Yang, Di Li, Yintang Yang
Format: Article
Language:English
Published: MDPI AG 2021-10-01
Series:Micromachines
Subjects:
equivalent model
through-silicon via
thermal analysis
thermal conductivity
Online Access:https://www.mdpi.com/2072-666X/12/10/1223

Internet

https://www.mdpi.com/2072-666X/12/10/1223

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