Microwave Soldering of Low-Resistance Conductive Joints—Technical and Economic Aspects

Microwave Soldering of Low-Resistance Conductive Joints—Technical and Economic Aspects

Soldering processes are applied in the fabrication of electronic circuits used in most modern domestic and industrial technologies. This article aims to introduce a new soldering technology based on the microwave joining of copper materials used in electronic applications. The study was focused on m...

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Bibliographic Details
Main Authors: Sorin Vasile Savu, Cristian Daniel Ghelsingher, Iulian Stefan, Nicusor-Alin Sîrbu, Daniela Tarniță, Dalia Simion, Ionel Dănuț Savu, Ionela Gabriela Bucșe, Traian Țunescu
Format: Article
Language:English
Published: MDPI AG 2023-04-01
Series:Materials
Subjects:
soldering
microwave heating
thermal field
mechanical characteristics
Online Access:https://www.mdpi.com/1996-1944/16/9/3311

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https://www.mdpi.com/1996-1944/16/9/3311

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