A Novel High-Q Dual-Mass MEMS Tuning Fork Gyroscope Based on 3D Wafer-Level Packaging

A Novel High-Q Dual-Mass MEMS Tuning Fork Gyroscope Based on 3D Wafer-Level Packaging

Tuning fork gyroscopes (TFGs) are promising for potential high-precision applications. This work proposes and experimentally demonstrates a novel high-Q dual-mass tuning fork microelectromechanical system (MEMS) gyroscope utilizing three-dimensional (3D) packaging techniques. Except for two symmetri...

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Bibliographic Details
Main Authors: Pengfei Xu, Chaowei Si, Yurong He, Zhenyu Wei, Lu Jia, Guowei Han, Jin Ning, Fuhua Yang
Format: Article
Language:English
Published: MDPI AG 2021-09-01
Series:Sensors
Subjects:
tuning fork gyroscope
MEMS
3D packaging
high Q-factors
Online Access:https://www.mdpi.com/1424-8220/21/19/6428

Internet

https://www.mdpi.com/1424-8220/21/19/6428

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