Design and Implementation of Automatic Cooling Case Based on High-Power and High-Density Power Supply Array

Design and Implementation of Automatic Cooling Case Based on High-Power and High-Density Power Supply Array

Multi-board electronic cases with high-density and power modules are widely used in industrial power supply management. Heat dissipation becomes an important factor in the design process in improving case performance and miniaturization requirements. The design of existing small electronic thermal m...

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Bibliographic Details
Main Authors: Zerui Chen, Hangwei Feng, Guoguang Zhang, Chong Yang
Format: Article
Language:English
Published: MDPI AG 2023-10-01
Series:Electronics
Subjects:
thermal design
miniaturization
high power
high density
automation
Online Access:https://www.mdpi.com/2079-9292/12/20/4353

Internet

https://www.mdpi.com/2079-9292/12/20/4353

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