Design and Implementation of Automatic Cooling Case Based on High-Power and High-Density Power Supply Array
Multi-board electronic cases with high-density and power modules are widely used in industrial power supply management. Heat dissipation becomes an important factor in the design process in improving case performance and miniaturization requirements. The design of existing small electronic thermal m...
Main Authors: | Zerui Chen, Hangwei Feng, Guoguang Zhang, Chong Yang |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2023-10-01
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Series: | Electronics |
Subjects: | |
Online Access: | https://www.mdpi.com/2079-9292/12/20/4353 |
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