Large-scale bare Cu bonding by 10 μm-sized Cu–Ag composite paste in low temperature low pressure air conditions
Three kinds of Cu–Ag composite paste were fabricated. We used 10 μm Cu particles as the main component of the paste as they are significantly cheaper than Ag and Cu nanoparticles. To understand the bonding performance and mechanism, the flake-shape Cu–Ag pastes with a different solvent and a Cu sphe...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2023-09-01
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| Series: | Journal of Science: Advanced Materials and Devices |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2468217923000758 |