Investigation of microstructure and wettability of selected lead-free solders for higher application temperatures
The work deals with the investigation of thermal properties and wettability of lead-free solders for higher application temperatures. For the research, the experimental solders SnSb5, ZnAl4, ZnAl6Ag6 and BiAg11 were used. For investigation of wettability, Ag, Cu and Ni substrates was used. To measur...
Main Authors: | , |
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Format: | Article |
Language: | English |
Published: |
AIMS Press
2018-09-01
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Series: | AIMS Materials Science |
Subjects: | |
Online Access: | http://www.aimspress.com/Materials/article/3075/fulltext.html |