Investigation of microstructure and wettability of selected lead-free solders for higher application temperatures

The work deals with the investigation of thermal properties and wettability of lead-free solders for higher application temperatures. For the research, the experimental solders SnSb5, ZnAl4, ZnAl6Ag6 and BiAg11 were used. For investigation of wettability, Ag, Cu and Ni substrates was used. To measur...

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Bibliographic Details
Main Authors: Roman Koleňák, Igor Kostolný
Format: Article
Language:English
Published: AIMS Press 2018-09-01
Series:AIMS Materials Science
Subjects:
Online Access:http://www.aimspress.com/Materials/article/3075/fulltext.html