Investigation of microstructure and wettability of selected lead-free solders for higher application temperatures
The work deals with the investigation of thermal properties and wettability of lead-free solders for higher application temperatures. For the research, the experimental solders SnSb5, ZnAl4, ZnAl6Ag6 and BiAg11 were used. For investigation of wettability, Ag, Cu and Ni substrates was used. To measur...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
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AIMS Press
2018-09-01
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| Series: | AIMS Materials Science |
| Subjects: | |
| Online Access: | http://www.aimspress.com/Materials/article/3075/fulltext.html |
| _version_ | 1818031770929463296 |
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| author | Roman Koleňák Igor Kostolný |
| author_facet | Roman Koleňák Igor Kostolný |
| author_sort | Roman Koleňák |
| collection | DOAJ |
| description | The work deals with the investigation of thermal properties and wettability of lead-free solders for higher application temperatures. For the research, the experimental solders SnSb5, ZnAl4, ZnAl6Ag6 and BiAg11 were used. For investigation of wettability, Ag, Cu and Ni substrates was used. To measure the solders melting intervals and their thermal properties, the DSC analysis was realized. The measurement of wettability was carried out in a controlled atmosphere by trigonometric method. Zn based solders wets none of the examined substrates. SnSb5 solder wets only Cu substrate with wetting angle of 54°. Soldering alloy BiAg11 wets all substrates, wherein the best result (23°) was achieved on Ag substrate. Shear strength of BiAg11 and SnSb5 joints reached higher value then classic PbSn5 solder. |
| first_indexed | 2024-12-10T05:56:46Z |
| format | Article |
| id | doaj.art-5ac5cf2cff8245d8b0bed4b65b381313 |
| institution | Directory Open Access Journal |
| issn | 2372-0484 |
| language | English |
| last_indexed | 2024-12-10T05:56:46Z |
| publishDate | 2018-09-01 |
| publisher | AIMS Press |
| record_format | Article |
| series | AIMS Materials Science |
| spelling | doaj.art-5ac5cf2cff8245d8b0bed4b65b3813132022-12-22T01:59:54ZengAIMS PressAIMS Materials Science2372-04842018-09-015588990110.3934/matersci.2018.5.889matersci-05-05-889Investigation of microstructure and wettability of selected lead-free solders for higher application temperaturesRoman Koleňák0Igor Kostolný1Slovak University of Technology in Bratislava, Faculty of Materials Science and Technology in Trnava, Jána Bottu č. 2781/25, 917 24 Trnava, Slovak RepublicSlovak University of Technology in Bratislava, Faculty of Materials Science and Technology in Trnava, Jána Bottu č. 2781/25, 917 24 Trnava, Slovak RepublicThe work deals with the investigation of thermal properties and wettability of lead-free solders for higher application temperatures. For the research, the experimental solders SnSb5, ZnAl4, ZnAl6Ag6 and BiAg11 were used. For investigation of wettability, Ag, Cu and Ni substrates was used. To measure the solders melting intervals and their thermal properties, the DSC analysis was realized. The measurement of wettability was carried out in a controlled atmosphere by trigonometric method. Zn based solders wets none of the examined substrates. SnSb5 solder wets only Cu substrate with wetting angle of 54°. Soldering alloy BiAg11 wets all substrates, wherein the best result (23°) was achieved on Ag substrate. Shear strength of BiAg11 and SnSb5 joints reached higher value then classic PbSn5 solder.http://www.aimspress.com/Materials/article/3075/fulltext.htmlsoldersubstratethermal propertieswettingprotective atmosphere |
| spellingShingle | Roman Koleňák Igor Kostolný Investigation of microstructure and wettability of selected lead-free solders for higher application temperatures AIMS Materials Science solder substrate thermal properties wetting protective atmosphere |
| title | Investigation of microstructure and wettability of selected lead-free solders for higher application temperatures |
| title_full | Investigation of microstructure and wettability of selected lead-free solders for higher application temperatures |
| title_fullStr | Investigation of microstructure and wettability of selected lead-free solders for higher application temperatures |
| title_full_unstemmed | Investigation of microstructure and wettability of selected lead-free solders for higher application temperatures |
| title_short | Investigation of microstructure and wettability of selected lead-free solders for higher application temperatures |
| title_sort | investigation of microstructure and wettability of selected lead free solders for higher application temperatures |
| topic | solder substrate thermal properties wetting protective atmosphere |
| url | http://www.aimspress.com/Materials/article/3075/fulltext.html |
| work_keys_str_mv | AT romankolenak investigationofmicrostructureandwettabilityofselectedleadfreesoldersforhigherapplicationtemperatures AT igorkostolny investigationofmicrostructureandwettabilityofselectedleadfreesoldersforhigherapplicationtemperatures |