Effect of Small Amount of Ni Addition on Microstructure and Fatigue Properties of Sn-Sb-Ag Lead-Free Solder

Effect of Small Amount of Ni Addition on Microstructure and Fatigue Properties of Sn-Sb-Ag Lead-Free Solder

The effect of the addition volume of Ni on the microstructures and tensile and fatigue properties of Sn-6.4Sb-3.9Ag (mass%) was investigated using micro-size specimens. The addition of Ni into Sn-6.4Sb-3.9Ag tends to increase the number of grains formed in the solidification process and produce a hi...

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Bibliographic Details
Main Authors: Mizuki Yamamoto, Ikuo Shohji, Tatsuya Kobayashi, Kohei Mitsui, Hirohiko Watanabe
Format: Article
Language:English
Published: MDPI AG 2021-07-01
Series:Materials
Subjects:
Sn-6.4Sb-3.9Ag
lead-free solder
Ni addition
microstructure
tensile properties
low cycle fatigue properties
Online Access:https://www.mdpi.com/1996-1944/14/14/3799

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https://www.mdpi.com/1996-1944/14/14/3799

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