Excellent Thermal and Dielectric Properties of Hexagonal Boron Nitride/Phenolic Resin Bulk Composite Material for Heatsink Applications
In the present paper, we report polymer composites based on phenolic resin filled with hexagonal boron nitride; hot compression molding coupled with solution-based mixing were used to manufacture the composites. The paper presents experimental results on the physical and physicochemical properties o...
Main Authors: | , , , , , |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2023-07-01
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Series: | Journal of Composites Science |
Subjects: | |
Online Access: | https://www.mdpi.com/2504-477X/7/7/291 |