Excellent Thermal and Dielectric Properties of Hexagonal Boron Nitride/Phenolic Resin Bulk Composite Material for Heatsink Applications
In the present paper, we report polymer composites based on phenolic resin filled with hexagonal boron nitride; hot compression molding coupled with solution-based mixing were used to manufacture the composites. The paper presents experimental results on the physical and physicochemical properties o...
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| Format: | Article |
| Language: | English |
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MDPI AG
2023-07-01
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| Series: | Journal of Composites Science |
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| Online Access: | https://www.mdpi.com/2504-477X/7/7/291 |
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| author | Egor A. Danilov Vladimir M. Samoilov Innokenty M. Kaplan Elena V. Medvedeva Andrey A. Stepashkin Victor V. Tcherdyntsev |
| author_facet | Egor A. Danilov Vladimir M. Samoilov Innokenty M. Kaplan Elena V. Medvedeva Andrey A. Stepashkin Victor V. Tcherdyntsev |
| author_sort | Egor A. Danilov |
| collection | DOAJ |
| description | In the present paper, we report polymer composites based on phenolic resin filled with hexagonal boron nitride; hot compression molding coupled with solution-based mixing were used to manufacture the composites. The paper presents experimental results on the physical and physicochemical properties of the obtained composites: thermal stability in air and argon, dielectric constant and dielectric loss tangent, active electrical resistance, thermal conductivity (mean and anisotropy), and mechanical strength. It is shown that the proposed technique of composite manufacturing, including the application of high-process pressures, makes it possible to obtain materials with high anisotropy of thermal conductivity, extremely high-filler content, and excellent dielectric properties, all of which are very important for prospective highly efficient lightweight heatsink elements for electronic devices. Experimental values of thermal conductivity and dielectric constant were analyzed using known mathematical models. Experimental values for thermal conductivities (up to 18.5 W·m<sup>−1</sup>·K<sup>−1</sup>) of composites at filler loadings of 65–85 vol.% are significantly higher than published data for bulk boron nitride/polymer composites. |
| first_indexed | 2024-03-11T00:56:40Z |
| format | Article |
| id | doaj.art-5d10114148eb415eb3e279d2f657fbfc |
| institution | Directory Open Access Journal |
| issn | 2504-477X |
| language | English |
| last_indexed | 2024-03-11T00:56:40Z |
| publishDate | 2023-07-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Journal of Composites Science |
| spelling | doaj.art-5d10114148eb415eb3e279d2f657fbfc2023-11-18T19:55:46ZengMDPI AGJournal of Composites Science2504-477X2023-07-017729110.3390/jcs7070291Excellent Thermal and Dielectric Properties of Hexagonal Boron Nitride/Phenolic Resin Bulk Composite Material for Heatsink ApplicationsEgor A. Danilov0Vladimir M. Samoilov1Innokenty M. Kaplan2Elena V. Medvedeva3Andrey A. Stepashkin4Victor V. Tcherdyntsev5Research Institute for Graphite-Based Structural Materials “NIIgrafit” (JSC “NIIgrafit”), Elektrodnaya Street 2, 111524 Moscow, RussiaResearch Institute for Graphite-Based Structural Materials “NIIgrafit” (JSC “NIIgrafit”), Elektrodnaya Street 2, 111524 Moscow, RussiaResearch Institute for Graphite-Based Structural Materials “NIIgrafit” (JSC “NIIgrafit”), Elektrodnaya Street 2, 111524 Moscow, RussiaMoscow Aviation Institute, Volokolamsk sh., 4, 125993 Moscow, RussiaLaboratory of Functional Polymer Materials, National University of Science and Technology “MISIS”, Leninskii Prosp, 4-1, 119049 Moscow, RussiaLaboratory of Functional Polymer Materials, National University of Science and Technology “MISIS”, Leninskii Prosp, 4-1, 119049 Moscow, RussiaIn the present paper, we report polymer composites based on phenolic resin filled with hexagonal boron nitride; hot compression molding coupled with solution-based mixing were used to manufacture the composites. The paper presents experimental results on the physical and physicochemical properties of the obtained composites: thermal stability in air and argon, dielectric constant and dielectric loss tangent, active electrical resistance, thermal conductivity (mean and anisotropy), and mechanical strength. It is shown that the proposed technique of composite manufacturing, including the application of high-process pressures, makes it possible to obtain materials with high anisotropy of thermal conductivity, extremely high-filler content, and excellent dielectric properties, all of which are very important for prospective highly efficient lightweight heatsink elements for electronic devices. Experimental values of thermal conductivity and dielectric constant were analyzed using known mathematical models. Experimental values for thermal conductivities (up to 18.5 W·m<sup>−1</sup>·K<sup>−1</sup>) of composites at filler loadings of 65–85 vol.% are significantly higher than published data for bulk boron nitride/polymer composites.https://www.mdpi.com/2504-477X/7/7/291heatsink materialspolymer-matrix compositesboron nitridethermal propertieselectrical propertiescompression molding |
| spellingShingle | Egor A. Danilov Vladimir M. Samoilov Innokenty M. Kaplan Elena V. Medvedeva Andrey A. Stepashkin Victor V. Tcherdyntsev Excellent Thermal and Dielectric Properties of Hexagonal Boron Nitride/Phenolic Resin Bulk Composite Material for Heatsink Applications Journal of Composites Science heatsink materials polymer-matrix composites boron nitride thermal properties electrical properties compression molding |
| title | Excellent Thermal and Dielectric Properties of Hexagonal Boron Nitride/Phenolic Resin Bulk Composite Material for Heatsink Applications |
| title_full | Excellent Thermal and Dielectric Properties of Hexagonal Boron Nitride/Phenolic Resin Bulk Composite Material for Heatsink Applications |
| title_fullStr | Excellent Thermal and Dielectric Properties of Hexagonal Boron Nitride/Phenolic Resin Bulk Composite Material for Heatsink Applications |
| title_full_unstemmed | Excellent Thermal and Dielectric Properties of Hexagonal Boron Nitride/Phenolic Resin Bulk Composite Material for Heatsink Applications |
| title_short | Excellent Thermal and Dielectric Properties of Hexagonal Boron Nitride/Phenolic Resin Bulk Composite Material for Heatsink Applications |
| title_sort | excellent thermal and dielectric properties of hexagonal boron nitride phenolic resin bulk composite material for heatsink applications |
| topic | heatsink materials polymer-matrix composites boron nitride thermal properties electrical properties compression molding |
| url | https://www.mdpi.com/2504-477X/7/7/291 |
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