Excellent Thermal and Dielectric Properties of Hexagonal Boron Nitride/Phenolic Resin Bulk Composite Material for Heatsink Applications

Excellent Thermal and Dielectric Properties of Hexagonal Boron Nitride/Phenolic Resin Bulk Composite Material for Heatsink Applications

In the present paper, we report polymer composites based on phenolic resin filled with hexagonal boron nitride; hot compression molding coupled with solution-based mixing were used to manufacture the composites. The paper presents experimental results on the physical and physicochemical properties o...

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Bibliographic Details
Main Authors: Egor A. Danilov, Vladimir M. Samoilov, Innokenty M. Kaplan, Elena V. Medvedeva, Andrey A. Stepashkin, Victor V. Tcherdyntsev
Format: Article
Language:English
Published: MDPI AG 2023-07-01
Series:Journal of Composites Science
Subjects:
heatsink materials
polymer-matrix composites
boron nitride
thermal properties
electrical properties
compression molding
Online Access:https://www.mdpi.com/2504-477X/7/7/291

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