Novel model of material removal rate on ultrasonic-assisted chemical mechanical polishing for sapphire
Abstract Ultrasonic-assisted chemical mechanical polishing (UA-CMP) can greatly improve the sapphire material removal and surface quality, but its polishing mechanism is still unclear. This paper proposed a novel model of material removal rate (MRR) to explore the mechanism of sapphire UA-CMP. It co...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
SpringerOpen
2023-02-01
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| Series: | Friction |
| Subjects: | |
| Online Access: | https://doi.org/10.1007/s40544-022-0713-7 |