Exploring Topological Semi-Metals for Interconnects

Exploring Topological Semi-Metals for Interconnects

The size of transistors has drastically reduced over the years. Interconnects have likewise also been scaled down. Today, conventional copper (Cu)-based interconnects face a significant impediment to further scaling since their electrical conductivity decreases at smaller dimensions, which also wors...

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Bibliographic Details
Main Authors: Satwik Kundu, Rupshali Roy, M. Saifur Rahman, Suryansh Upadhyay, Rasit Onur Topaloglu, Suzanne E. Mohney, Shengxi Huang, Swaroop Ghosh
Format: Article
Language:English
Published: MDPI AG 2023-02-01
Series:Journal of Low Power Electronics and Applications
Subjects:
local interconnect
global interconnect
Weyl semi-metal
propagation delay
instructions per cycle
cache design
Online Access:https://www.mdpi.com/2079-9268/13/1/16

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https://www.mdpi.com/2079-9268/13/1/16

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