Curing kinetics study of thermosetting resin material with ultra-low dielectric loss for advanced electronic packaging
Ultra-low-loss resin materials are widely utilized in the novel electronic packaging. In this study, we have investigated the curing reaction kinetics of ultra-low-loss thermosetting resin systems represented by thermosetting polyphenylene oxide/small molecule crosslinking agent triallyl isocyanurat...
| Main Authors: | , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2024-01-01
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| Series: | Polymer Testing |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S0142941823003926 |