Reduced Etch Lag and High Aspect Ratios by Deep Reactive Ion Etching (DRIE)

Reduced Etch Lag and High Aspect Ratios by Deep Reactive Ion Etching (DRIE)

Deep reactive ion etching (DRIE) with the Bosch process is one of the key procedures used to manufacture micron-sized structures for MEMS and microfluidic applications in silicon and, hence, of increasing importance for miniaturisation in biomedical research. While guaranteeing high aspect ratio str...

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Bibliographic Details
Main Authors: Michael S. Gerlt, Nino F. Läubli, Michel Manser, Bradley J. Nelson, Jürg Dual
Format: Article
Language:English
Published: MDPI AG 2021-05-01
Series:Micromachines
Subjects:
fabrication
deep reactive ion etching
process optimization
reduced etch lag
high aspect ratio
small structures
Online Access:https://www.mdpi.com/2072-666X/12/5/542

Internet

https://www.mdpi.com/2072-666X/12/5/542

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