Interfacial microstructure evolution and bonding mechanism transformation of CoCrFeMnNi high-entropy alloy joints fabricated by vacuum hot-compression bonding

Interfacial microstructure evolution and bonding mechanism transformation of CoCrFeMnNi high-entropy alloy joints fabricated by vacuum hot-compression bonding

Vacuum hot-compression bonding (VHCB) is a promising solid-phase bonding technology, but its feasibility and applicability in high entropy alloy (HEA) are still unclear. Herein, the VHCB process of CoCrFeMnNi HEA was investigated, and the interfacial bonding quality was comprehensively evaluated via...

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Bibliographic Details
Main Authors: Chuanzong Li, Yi Zheng, Yajie Wang, Chun Yu, Jieshi Chen, Hao Lu, Kejin Zhang
Format: Article
Language:English
Published: Elsevier 2023-07-01
Series:Journal of Materials Research and Technology
Subjects:
High-entropy alloy
Vacuum hot-compression bonding
Twin-induced interfacial boundary migration
Dynamic recrystallization
Interfacial oxide particle
Online Access:http://www.sciencedirect.com/science/article/pii/S2238785423013601

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http://www.sciencedirect.com/science/article/pii/S2238785423013601

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