Performance of amorphization AlCrTiZrMo high entropy alloy barrier for copper metallization
A reliable ultra-thin diffusion barrier is required for Cu interconnection. High entropy alloy (HEA) films have received attention in the development of diffusion barrier materials due to their remarkable properties. Here, the dense and smooth 17 nm AlCrTiZrMo high entropy alloy amorphous film (HEAA...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2024-01-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S223878542303209X |