Multi-Foci Laser Separation of Sapphire Wafers with Partial Thickness Scanning

Multi-Foci Laser Separation of Sapphire Wafers with Partial Thickness Scanning

With multi-foci laser cutting technology for sapphire wafer separation, the entire cross-section is generally scanned with single or multiple passes. This investigation proposes a new separation technique through partial thickness scanning. The energy effectivity and efficiency of the picosecond las...

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Bibliographic Details
Main Authors: Celescia Siew Mun Lye, Zhongke Wang, Yee Cheong Lam
Format: Article
Language:English
Published: MDPI AG 2022-03-01
Series:Micromachines
Subjects:
multi-foci
two-zone partial thickness scanning
sapphire wafer
laser microprocessing
nonlinear absorption
Online Access:https://www.mdpi.com/2072-666X/13/4/506

Internet

https://www.mdpi.com/2072-666X/13/4/506

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