Realization of Three-Dimensionally MEMS Stacked Comb Structures for Microactuators Using Low-Temperature Multi-Wafer Bonding with Self-Alignment Techniques in CMOS-Compatible Processes

Realization of Three-Dimensionally MEMS Stacked Comb Structures for Microactuators Using Low-Temperature Multi-Wafer Bonding with Self-Alignment Techniques in CMOS-Compatible Processes

A high-aspect-ratio three-dimensionally (3D) stacked comb structure for micromirror application is demonstrated by wafer bonding technology in CMOS-compatible processes in this work. A vertically stacked comb structure is designed to circumvent any misalignment issues that could arise from multiple...

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Bibliographic Details
Main Authors: Adrian J. T. Teo, King Ho Holden Li
Format: Article
Language:English
Published: MDPI AG 2021-11-01
Series:Micromachines
Subjects:
3D MEMS
wafer bonding
CMOS–MEMS compatibility
multiple wafer stacking
alignment error corrections
Online Access:https://www.mdpi.com/2072-666X/12/12/1481

Internet

https://www.mdpi.com/2072-666X/12/12/1481

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