Comprehensive elemental screening of solid-solution copper alloys

Comprehensive elemental screening of solid-solution copper alloys

Significantly improving the balance between the mechanical strength and electrical conductivity of solid-solution copper alloys is considered difficult. In this study, a comprehensive elemental screening framework is proposed to predict the solid-solution strengthening and electrical resistivity of...

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Bibliographic Details
Main Authors: Kenji Yamaguchi, Takuya Ishigaki, Yuki Inoue, Shuhei Arisawa, Hirotaka Matsunoshita, Yuki Ito, Hiroyuki Mori, Ken’ichiro Suehiro, Kazunari Maki, Kenji Nagata, Masahiko Demura
Format: Article
Language:English
Published: Taylor & Francis Group 2023-12-01
Series:Science and Technology of Advanced Materials: Methods
Subjects:
alloy design
copper alloys
mechanical properties
electrical resistivity/conductivity
density functional theory (dft)
modelling
Online Access:http://dx.doi.org/10.1080/27660400.2023.2250704

Internet

http://dx.doi.org/10.1080/27660400.2023.2250704

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