Schottky-Embedded Isolation Ring to Improve Latch-Up Immunity Between HV and LV Circuits in a 0.18 μm BCD Technology
As the high-voltage (HV) and low-voltage (LV) circuits are integrated together in a common silicon substrate, the parasitic latch-up path between neighboring HV and LV circuits with limited spacing in layout would be triggered into latch-up state to cause unrecoverable failure in the chip. In this w...
Main Authors: | , |
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Format: | Article |
Language: | English |
Published: |
IEEE
2022-01-01
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Series: | IEEE Journal of the Electron Devices Society |
Subjects: | |
Online Access: | https://ieeexplore.ieee.org/document/9816057/ |