Interface regulation of micro-sized sintered Ag-10Al composite based on in-situ surface modification and enhanced microstructure stability in power electronic packaging

Interface regulation of micro-sized sintered Ag-10Al composite based on in-situ surface modification and enhanced microstructure stability in power electronic packaging

The increasing demand for high-power SiC semiconductors necessitate the development of a die attachment material that combines high-temperature resistance, reliability, and cost-effectiveness. In this study, a novel micro-sized composite, Ag-10Al paste, containing 10 wt% Al particles, was designed....

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Bibliographic Details
Main Authors: Fupeng Huo, Chuantong Chen, Zheng Zhang, Ye Wang, Aiji Suetake, Kazutaka Takeshita, Yoshiji Yamaguchi, Yashima Momose, Katsuaki Suganuma
Format: Article
Language:English
Published: Elsevier 2024-04-01
Series:Materials & Design
Subjects:
Sintered Ag-Al composite
Surface modification
Interface
In-situ TEM
Microstructure
Reliability
Online Access:http://www.sciencedirect.com/science/article/pii/S0264127524002363

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http://www.sciencedirect.com/science/article/pii/S0264127524002363

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