Interface regulation of micro-sized sintered Ag-10Al composite based on in-situ surface modification and enhanced microstructure stability in power electronic packaging
The increasing demand for high-power SiC semiconductors necessitate the development of a die attachment material that combines high-temperature resistance, reliability, and cost-effectiveness. In this study, a novel micro-sized composite, Ag-10Al paste, containing 10 wt% Al particles, was designed....
| Main Authors: | , , , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2024-04-01
|
| Series: | Materials & Design |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S0264127524002363 |
| _version_ | 1797214958185873408 |
|---|---|
| author | Fupeng Huo Chuantong Chen Zheng Zhang Ye Wang Aiji Suetake Kazutaka Takeshita Yoshiji Yamaguchi Yashima Momose Katsuaki Suganuma |
| author_facet | Fupeng Huo Chuantong Chen Zheng Zhang Ye Wang Aiji Suetake Kazutaka Takeshita Yoshiji Yamaguchi Yashima Momose Katsuaki Suganuma |
| author_sort | Fupeng Huo |
| collection | DOAJ |
| description | The increasing demand for high-power SiC semiconductors necessitate the development of a die attachment material that combines high-temperature resistance, reliability, and cost-effectiveness. In this study, a novel micro-sized composite, Ag-10Al paste, containing 10 wt% Al particles, was designed. A remarkable phenomenon, the ejection of ultrafine Ag nanoparticles from micron-sized Ag flakes, was observed for the first time. The phenomenon was utilized for the in-situ surface modification of Al. Subsequently, the microstructure and mechanical properties of the sintered Ag-10Al/direct bonded copper (DBC) joints were studied. Results indicated that the Ag-10Al composite exhibited superior microstructure stability compared to sintered Ag. The Ag/Al interface was systematically analyzed, revealing a unique Ag/nano Ag2O/Al2O3 amorphous/Al structure. This structure was formed through the Ag nanoparticle jetting effect of Ag flakes, achieving effective bonding between nano Ag2O and Al2O3 amorphous phases through mutual dissolution at the atomic level. Moreover, the sintered Ag-10Al joint demonstrated enhanced mechanical performance stability over the sintered Ag joint. After 1000 h aging at 300 ℃, the shear strength of the sintered Ag-10Al joint reached 34.1 MPa, meeting the requirements for power semiconductor packaging. In conclusion, the Ag-10Al composite paste was thoughtfully designed, excelling in both performance and cost-effectiveness. |
| first_indexed | 2024-04-24T11:22:26Z |
| format | Article |
| id | doaj.art-613e4af0639e4165ab6ea989091bba09 |
| institution | Directory Open Access Journal |
| issn | 0264-1275 |
| language | English |
| last_indexed | 2024-04-24T11:22:26Z |
| publishDate | 2024-04-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Materials & Design |
| spelling | doaj.art-613e4af0639e4165ab6ea989091bba092024-04-11T04:40:45ZengElsevierMaterials & Design0264-12752024-04-01240112863Interface regulation of micro-sized sintered Ag-10Al composite based on in-situ surface modification and enhanced microstructure stability in power electronic packagingFupeng Huo0Chuantong Chen1Zheng Zhang2Ye Wang3Aiji Suetake4Kazutaka Takeshita5Yoshiji Yamaguchi6Yashima Momose7Katsuaki Suganuma8Flexible 3D System integration Laboratory, The Institute of Science and Industrial Research, Osaka University, Osaka 565-0871, JapanFlexible 3D System integration Laboratory, The Institute of Science and Industrial Research, Osaka University, Osaka 565-0871, Japan; Corresponding author.Flexible 3D System integration Laboratory, The Institute of Science and Industrial Research, Osaka University, Osaka 565-0871, JapanSchool of Reliability and Systems Engineering, Beihang University, Beijing 100191, ChinaFlexible 3D System integration Laboratory, The Institute of Science and Industrial Research, Osaka University, Osaka 565-0871, JapanYamato Scientific Co. Ltd., Tokyo 104-0053, JapanYamato Scientific Co. Ltd., Tokyo 104-0053, JapanYamato Scientific Co. Ltd., Tokyo 104-0053, JapanFlexible 3D System integration Laboratory, The Institute of Science and Industrial Research, Osaka University, Osaka 565-0871, JapanThe increasing demand for high-power SiC semiconductors necessitate the development of a die attachment material that combines high-temperature resistance, reliability, and cost-effectiveness. In this study, a novel micro-sized composite, Ag-10Al paste, containing 10 wt% Al particles, was designed. A remarkable phenomenon, the ejection of ultrafine Ag nanoparticles from micron-sized Ag flakes, was observed for the first time. The phenomenon was utilized for the in-situ surface modification of Al. Subsequently, the microstructure and mechanical properties of the sintered Ag-10Al/direct bonded copper (DBC) joints were studied. Results indicated that the Ag-10Al composite exhibited superior microstructure stability compared to sintered Ag. The Ag/Al interface was systematically analyzed, revealing a unique Ag/nano Ag2O/Al2O3 amorphous/Al structure. This structure was formed through the Ag nanoparticle jetting effect of Ag flakes, achieving effective bonding between nano Ag2O and Al2O3 amorphous phases through mutual dissolution at the atomic level. Moreover, the sintered Ag-10Al joint demonstrated enhanced mechanical performance stability over the sintered Ag joint. After 1000 h aging at 300 ℃, the shear strength of the sintered Ag-10Al joint reached 34.1 MPa, meeting the requirements for power semiconductor packaging. In conclusion, the Ag-10Al composite paste was thoughtfully designed, excelling in both performance and cost-effectiveness.http://www.sciencedirect.com/science/article/pii/S0264127524002363Sintered Ag-Al compositeSurface modificationInterfaceIn-situ TEMMicrostructureReliability |
| spellingShingle | Fupeng Huo Chuantong Chen Zheng Zhang Ye Wang Aiji Suetake Kazutaka Takeshita Yoshiji Yamaguchi Yashima Momose Katsuaki Suganuma Interface regulation of micro-sized sintered Ag-10Al composite based on in-situ surface modification and enhanced microstructure stability in power electronic packaging Materials & Design Sintered Ag-Al composite Surface modification Interface In-situ TEM Microstructure Reliability |
| title | Interface regulation of micro-sized sintered Ag-10Al composite based on in-situ surface modification and enhanced microstructure stability in power electronic packaging |
| title_full | Interface regulation of micro-sized sintered Ag-10Al composite based on in-situ surface modification and enhanced microstructure stability in power electronic packaging |
| title_fullStr | Interface regulation of micro-sized sintered Ag-10Al composite based on in-situ surface modification and enhanced microstructure stability in power electronic packaging |
| title_full_unstemmed | Interface regulation of micro-sized sintered Ag-10Al composite based on in-situ surface modification and enhanced microstructure stability in power electronic packaging |
| title_short | Interface regulation of micro-sized sintered Ag-10Al composite based on in-situ surface modification and enhanced microstructure stability in power electronic packaging |
| title_sort | interface regulation of micro sized sintered ag 10al composite based on in situ surface modification and enhanced microstructure stability in power electronic packaging |
| topic | Sintered Ag-Al composite Surface modification Interface In-situ TEM Microstructure Reliability |
| url | http://www.sciencedirect.com/science/article/pii/S0264127524002363 |
| work_keys_str_mv | AT fupenghuo interfaceregulationofmicrosizedsinteredag10alcompositebasedoninsitusurfacemodificationandenhancedmicrostructurestabilityinpowerelectronicpackaging AT chuantongchen interfaceregulationofmicrosizedsinteredag10alcompositebasedoninsitusurfacemodificationandenhancedmicrostructurestabilityinpowerelectronicpackaging AT zhengzhang interfaceregulationofmicrosizedsinteredag10alcompositebasedoninsitusurfacemodificationandenhancedmicrostructurestabilityinpowerelectronicpackaging AT yewang interfaceregulationofmicrosizedsinteredag10alcompositebasedoninsitusurfacemodificationandenhancedmicrostructurestabilityinpowerelectronicpackaging AT aijisuetake interfaceregulationofmicrosizedsinteredag10alcompositebasedoninsitusurfacemodificationandenhancedmicrostructurestabilityinpowerelectronicpackaging AT kazutakatakeshita interfaceregulationofmicrosizedsinteredag10alcompositebasedoninsitusurfacemodificationandenhancedmicrostructurestabilityinpowerelectronicpackaging AT yoshijiyamaguchi interfaceregulationofmicrosizedsinteredag10alcompositebasedoninsitusurfacemodificationandenhancedmicrostructurestabilityinpowerelectronicpackaging AT yashimamomose interfaceregulationofmicrosizedsinteredag10alcompositebasedoninsitusurfacemodificationandenhancedmicrostructurestabilityinpowerelectronicpackaging AT katsuakisuganuma interfaceregulationofmicrosizedsinteredag10alcompositebasedoninsitusurfacemodificationandenhancedmicrostructurestabilityinpowerelectronicpackaging |