Flexural Fatigue Test—A Proposed Method to Characterize the Lifetime of Conductor Tracks on Polymeric Substrates
High quality and long product life are two fundamental requirements for all circuit carriers, including molded interconnect devices (MID), to find application in various fields, such as automotive, sensor technology, medical technology, and communication technology. When developing a MID for a certa...
Main Authors: | Simon Petillon, Andrea Knöller, Philipp Bräuer, David Helm, Tobias Grözinger, Sascha Weser, Wolfgang Eberhardt, Jörg Franke, André Zimmermann |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2022-04-01
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Series: | Journal of Manufacturing and Materials Processing |
Subjects: | |
Online Access: | https://www.mdpi.com/2504-4494/6/2/41 |
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