Prediction of Microwave Characteristic Parameters Based on MMIC Gold Wire Bonding
In this paper, a method based on deep learning is proposed to predict the parameters of bonded metal wires, which solves the problem that the transmission characteristics of S-parameters cannot be predicted. In an X-band microwave chip circuit, gold wire bonding technology is often used to realize b...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2023-08-01
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| Series: | Applied Sciences |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2076-3417/13/17/9631 |