Selective Cu Electrodeposition on Micrometer Trenches Using Microcontact Printing and Additives
Selective deposition was performed on a micrometer trench pattern using a microcontact printing (μCP) process. Alkanethiols required for selective deposition were analyzed according to the carbon chain by linear sweep voltammetry (LSV). According to the LSV analysis, the effect of inhibiting Cu depo...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Polish Academy of Sciences
2021-09-01
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| Series: | Archives of Metallurgy and Materials |
| Subjects: | |
| Online Access: | https://journals.pan.pl/Content/119245/PDF/AMM-2021-3-14-Bongyoung%20Yoo.pdf |