A Deep Convolutional Neural Network-Based Multi-Class Image Classification for Automatic Wafer Map Failure Recognition in Semiconductor Manufacturing

A Deep Convolutional Neural Network-Based Multi-Class Image Classification for Automatic Wafer Map Failure Recognition in Semiconductor Manufacturing

Wafer maps provide engineers with important information about the root causes of failures during the semiconductor manufacturing process. Through the efficient recognition of the wafer map failure pattern type, the semiconductor manufacturing process and its product performance can be improved, as w...

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Bibliographic Details
Main Authors: Huilin Zheng, Syed Waseem Abbas Sherazi, Sang Hyeok Son, Jong Yun Lee
Format: Article
Language:English
Published: MDPI AG 2021-10-01
Series:Applied Sciences
Subjects:
wafer map failure recognition
machine learning
deep learning
convolutional neural network
multi-class classification
image data
Online Access:https://www.mdpi.com/2076-3417/11/20/9769

Internet

https://www.mdpi.com/2076-3417/11/20/9769

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