Study on the Preparation and Performance of Low-Temperature Sintering and High-Thermal-Conductivity Silver Nanowire Film
This paper proposes a new silver nanoscale joining material, silver nanowire film, as an alternative joining approach for high-power and large-size chip packaging. The silver nanowire film was prepared by pressing filtration with silver nanowire that was synthesized using the polyol method. We found...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2023-04-01
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| Series: | Metals |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2075-4701/13/4/819 |