Air-Based Contactless Wafer Precision Positioning System
This paper presents the development of a contactless sensing system and the dynamic evaluation of an air-bearing-based precision wafer positioning system. The contactless positioning stage is a response to the trend seen in the high-tech industry, where the substrates are becoming thinner and larger...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2021-08-01
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| Series: | Applied Sciences |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2076-3417/11/16/7588 |