Preferential growth of intermetallics under temperature gradient at Cu–Sn interface during transient liquid phase bonding: insights from phase field simulation
Transient liquid phase bonding under temperature gradient in electronics interconnections yields intermetallic grains at the bonding interface with different morphological features compared with conventional soldering process. However, the interfacial reactions due to the thermal gradient that resul...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2022-07-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785422007086 |