Heat transfer of thin flat heat pipes with gradually varied vapor–liquid channels
The heat flow density is constantly increasing due to the growing demand for the integration and compaction of electronic devices. A sintered thin flat heat pipe (TFHP) is a typical device for managing the heat flux of highly integrated electronic circuits. Four different structures of the vapor–liq...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
AIP Publishing LLC
2023-01-01
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| Series: | AIP Advances |
| Online Access: | http://dx.doi.org/10.1063/5.0134229 |