Heat transfer of thin flat heat pipes with gradually varied vapor–liquid channels
The heat flow density is constantly increasing due to the growing demand for the integration and compaction of electronic devices. A sintered thin flat heat pipe (TFHP) is a typical device for managing the heat flux of highly integrated electronic circuits. Four different structures of the vapor–liq...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
AIP Publishing LLC
2023-01-01
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| Series: | AIP Advances |
| Online Access: | http://dx.doi.org/10.1063/5.0134229 |
| _version_ | 1811172563626229760 |
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| author | Guohong Peng Zhikun Zhang Yaxin Wang Yanhui Zhang Zhengang Zhao |
| author_facet | Guohong Peng Zhikun Zhang Yaxin Wang Yanhui Zhang Zhengang Zhao |
| author_sort | Guohong Peng |
| collection | DOAJ |
| description | The heat flow density is constantly increasing due to the growing demand for the integration and compaction of electronic devices. A sintered thin flat heat pipe (TFHP) is a typical device for managing the heat flux of highly integrated electronic circuits. Four different structures of the vapor–liquid flow channel architecture are designed in this work. Heat transfer performance tests of different TFHPs are carried out for different thermal powers. The surface temperature distribution and thermal resistance of the TFHP under different operating conditions are investigated. The experimental results show that the design of the vapor–liquid flow channel significantly impacts the TFHP’s heat transfer performance and that the wedge-shaped wick is better suited to the flow channel. The wedge-shaped wick has the lowest thermal resistance of 0.28 °C/W and the most elevated maximum thermal power of 22 W. The heat dispatch performance of the sintered wick TFHP is improved. |
| first_indexed | 2024-04-10T17:33:27Z |
| format | Article |
| id | doaj.art-648edec4418e46a1ad00739793f67e5e |
| institution | Directory Open Access Journal |
| issn | 2158-3226 |
| language | English |
| last_indexed | 2024-04-10T17:33:27Z |
| publishDate | 2023-01-01 |
| publisher | AIP Publishing LLC |
| record_format | Article |
| series | AIP Advances |
| spelling | doaj.art-648edec4418e46a1ad00739793f67e5e2023-02-03T16:42:07ZengAIP Publishing LLCAIP Advances2158-32262023-01-01131015319015319-810.1063/5.0134229Heat transfer of thin flat heat pipes with gradually varied vapor–liquid channelsGuohong Peng0Zhikun Zhang1Yaxin Wang2Yanhui Zhang3Zhengang Zhao4Faculty of Information Engineering and Automation, Kunming University of Science and Technology, Kunming 650500, ChinaFaculty of Information Engineering and Automation, Kunming University of Science and Technology, Kunming 650500, ChinaFaculty of Information Engineering and Automation, Kunming University of Science and Technology, Kunming 650500, ChinaFaculty of Information Engineering and Automation, Kunming University of Science and Technology, Kunming 650500, ChinaFaculty of Information Engineering and Automation, Kunming University of Science and Technology, Kunming 650500, ChinaThe heat flow density is constantly increasing due to the growing demand for the integration and compaction of electronic devices. A sintered thin flat heat pipe (TFHP) is a typical device for managing the heat flux of highly integrated electronic circuits. Four different structures of the vapor–liquid flow channel architecture are designed in this work. Heat transfer performance tests of different TFHPs are carried out for different thermal powers. The surface temperature distribution and thermal resistance of the TFHP under different operating conditions are investigated. The experimental results show that the design of the vapor–liquid flow channel significantly impacts the TFHP’s heat transfer performance and that the wedge-shaped wick is better suited to the flow channel. The wedge-shaped wick has the lowest thermal resistance of 0.28 °C/W and the most elevated maximum thermal power of 22 W. The heat dispatch performance of the sintered wick TFHP is improved.http://dx.doi.org/10.1063/5.0134229 |
| spellingShingle | Guohong Peng Zhikun Zhang Yaxin Wang Yanhui Zhang Zhengang Zhao Heat transfer of thin flat heat pipes with gradually varied vapor–liquid channels AIP Advances |
| title | Heat transfer of thin flat heat pipes with gradually varied vapor–liquid channels |
| title_full | Heat transfer of thin flat heat pipes with gradually varied vapor–liquid channels |
| title_fullStr | Heat transfer of thin flat heat pipes with gradually varied vapor–liquid channels |
| title_full_unstemmed | Heat transfer of thin flat heat pipes with gradually varied vapor–liquid channels |
| title_short | Heat transfer of thin flat heat pipes with gradually varied vapor–liquid channels |
| title_sort | heat transfer of thin flat heat pipes with gradually varied vapor liquid channels |
| url | http://dx.doi.org/10.1063/5.0134229 |
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