Microstructural analysis of Sn-3.0Ag-0.5Cu-TiO2 composite solder alloy after selective electrochemical etching

Microstructural analysis of Sn-3.0Ag-0.5Cu-TiO2 composite solder alloy after selective electrochemical etching

This work aims to provide deep morphological observation on the incorporated TiO _2 nanoparticles within the SAC305 by selective electrochemical etching. Cyclic voltammetry and chronoamperometry were used to investigate the selective etching performances. The removal of β -Sn matrix was conducted at...

Full description

Bibliographic Details
Main Authors: Muhamad Zamri Yahaya, Muhammad Firdaus Mohd Nazeri, Soorathep Kheawhom, Balázs Illés, Agata Skwarek, Ahmad Azmin Mohamad
Format: Article
Language:English
Published: IOP Publishing 2020-01-01
Series:Materials Research Express
Subjects:
intermetallic compounds
microstructure
SAC
reflow soldering
TiO2 nanoparticles
Online Access:https://doi.org/10.1088/2053-1591/ab6b57

Internet

https://doi.org/10.1088/2053-1591/ab6b57

Similar Items