Microstructural analysis of Sn-3.0Ag-0.5Cu-TiO2 composite solder alloy after selective electrochemical etching
This work aims to provide deep morphological observation on the incorporated TiO _2 nanoparticles within the SAC305 by selective electrochemical etching. Cyclic voltammetry and chronoamperometry were used to investigate the selective etching performances. The removal of β -Sn matrix was conducted at...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
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IOP Publishing
2020-01-01
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| Series: | Materials Research Express |
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| Online Access: | https://doi.org/10.1088/2053-1591/ab6b57 |
| _version_ | 1797747014123913216 |
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| author | Muhamad Zamri Yahaya Muhammad Firdaus Mohd Nazeri Soorathep Kheawhom Balázs Illés Agata Skwarek Ahmad Azmin Mohamad |
| author_facet | Muhamad Zamri Yahaya Muhammad Firdaus Mohd Nazeri Soorathep Kheawhom Balázs Illés Agata Skwarek Ahmad Azmin Mohamad |
| author_sort | Muhamad Zamri Yahaya |
| collection | DOAJ |
| description | This work aims to provide deep morphological observation on the incorporated TiO _2 nanoparticles within the SAC305 by selective electrochemical etching. Cyclic voltammetry and chronoamperometry were used to investigate the selective etching performances. The removal of β -Sn matrix was conducted at a fixed potential of −350 mV. Average performances of 2.19 and 2.30 mA were attained from the chronoamperometry. The efficiency of β -Sn removal was approved according to the reduction of the intensities on the phase analysis. Successful observation of the TiO _2 near the Cu _6 Sn _5 layer was attained for an optimum duration of 120 s. Clusters of TiO _2 nanoparticles were entrapped by Cu _6 Sn _5 and Ag _3 Sn intermetallic compound (IMC) layer network and at the solder/substrate interface. The presence of TiO _2 nanoparticles at the solder interface suppresses the growth of the Cu _6 Sn _5 IMC layer. The absence of a β -Sn matrix also allowed in-depth morphological observations to be made of the shape and size of the Cu _6 Sn _5 and Ag _3 Sn. It was found that TiO _2 content facilitates the β -Sn removal, which allows better observation of the IMC phases as well as the TiO _2 reinforcement particles. |
| first_indexed | 2024-03-12T15:45:03Z |
| format | Article |
| id | doaj.art-64ec2cfd177e40edbb2cfa5f1cbd01a3 |
| institution | Directory Open Access Journal |
| issn | 2053-1591 |
| language | English |
| last_indexed | 2024-03-12T15:45:03Z |
| publishDate | 2020-01-01 |
| publisher | IOP Publishing |
| record_format | Article |
| series | Materials Research Express |
| spelling | doaj.art-64ec2cfd177e40edbb2cfa5f1cbd01a32023-08-09T15:28:38ZengIOP PublishingMaterials Research Express2053-15912020-01-017101658310.1088/2053-1591/ab6b57Microstructural analysis of Sn-3.0Ag-0.5Cu-TiO2 composite solder alloy after selective electrochemical etchingMuhamad Zamri Yahaya0Muhammad Firdaus Mohd Nazeri1Soorathep Kheawhom2Balázs Illés3Agata Skwarek4Ahmad Azmin Mohamad5https://orcid.org/0000-0001-5525-7100School of Materials and Mineral Resources Engineering, Universiti Sains Malaysia , 14300, Nibong Tebal, Penang, MalaysiaSchool of Materials Engineering, Universiti Malaysia Perlis , 02600 Jejawi, Kangar, Perlis, MalaysiaDepartment of Chemical Engineering, Faculty of Engineering, Chulalongkorn University , Bangkok 10330, ThailandDepartment of Electronics Technology, Budapest University of Technology and Economics , Budapest, HungaryDepartment of Marine Electronics, Gdynia Maritime University , Gdynia, Poland; Łukasiewicz Research Network—Institute of Electron Technology, Kraków Division, Krakow, PolandSchool of Materials and Mineral Resources Engineering, Universiti Sains Malaysia , 14300, Nibong Tebal, Penang, MalaysiaThis work aims to provide deep morphological observation on the incorporated TiO _2 nanoparticles within the SAC305 by selective electrochemical etching. Cyclic voltammetry and chronoamperometry were used to investigate the selective etching performances. The removal of β -Sn matrix was conducted at a fixed potential of −350 mV. Average performances of 2.19 and 2.30 mA were attained from the chronoamperometry. The efficiency of β -Sn removal was approved according to the reduction of the intensities on the phase analysis. Successful observation of the TiO _2 near the Cu _6 Sn _5 layer was attained for an optimum duration of 120 s. Clusters of TiO _2 nanoparticles were entrapped by Cu _6 Sn _5 and Ag _3 Sn intermetallic compound (IMC) layer network and at the solder/substrate interface. The presence of TiO _2 nanoparticles at the solder interface suppresses the growth of the Cu _6 Sn _5 IMC layer. The absence of a β -Sn matrix also allowed in-depth morphological observations to be made of the shape and size of the Cu _6 Sn _5 and Ag _3 Sn. It was found that TiO _2 content facilitates the β -Sn removal, which allows better observation of the IMC phases as well as the TiO _2 reinforcement particles.https://doi.org/10.1088/2053-1591/ab6b57intermetallic compoundsmicrostructureSACreflow solderingTiO2 nanoparticles |
| spellingShingle | Muhamad Zamri Yahaya Muhammad Firdaus Mohd Nazeri Soorathep Kheawhom Balázs Illés Agata Skwarek Ahmad Azmin Mohamad Microstructural analysis of Sn-3.0Ag-0.5Cu-TiO2 composite solder alloy after selective electrochemical etching Materials Research Express intermetallic compounds microstructure SAC reflow soldering TiO2 nanoparticles |
| title | Microstructural analysis of Sn-3.0Ag-0.5Cu-TiO2 composite solder alloy after selective electrochemical etching |
| title_full | Microstructural analysis of Sn-3.0Ag-0.5Cu-TiO2 composite solder alloy after selective electrochemical etching |
| title_fullStr | Microstructural analysis of Sn-3.0Ag-0.5Cu-TiO2 composite solder alloy after selective electrochemical etching |
| title_full_unstemmed | Microstructural analysis of Sn-3.0Ag-0.5Cu-TiO2 composite solder alloy after selective electrochemical etching |
| title_short | Microstructural analysis of Sn-3.0Ag-0.5Cu-TiO2 composite solder alloy after selective electrochemical etching |
| title_sort | microstructural analysis of sn 3 0ag 0 5cu tio2 composite solder alloy after selective electrochemical etching |
| topic | intermetallic compounds microstructure SAC reflow soldering TiO2 nanoparticles |
| url | https://doi.org/10.1088/2053-1591/ab6b57 |
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