Effect of Intermetallic Compound Bridging on the Cracking Resistance of Sn2.3Ag Microbumps with Different UBM Structures under Thermal Cycling
In this study, the effect of intermetallic compound (IMC) bridging on the cracking resistance of microbumps with two different under bump metallization (UBM) systems, Cu/solder/Cu and Cu/solder/Ni, under a thermal cycling test (TCT) is investigated. The height of the Sn2.3Ag solders was ~10 µm, whic...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2021-07-01
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| Series: | Metals |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2075-4701/11/7/1065 |