Effect of Intermetallic Compound Bridging on the Cracking Resistance of Sn2.3Ag Microbumps with Different UBM Structures under Thermal Cycling
In this study, the effect of intermetallic compound (IMC) bridging on the cracking resistance of microbumps with two different under bump metallization (UBM) systems, Cu/solder/Cu and Cu/solder/Ni, under a thermal cycling test (TCT) is investigated. The height of the Sn2.3Ag solders was ~10 µm, whic...
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MDPI AG
2021-07-01
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| Series: | Metals |
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| Online Access: | https://www.mdpi.com/2075-4701/11/7/1065 |
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| author | Chun-Chieh Mo Dinh-Phuc Tran Jing-Ye Juang Chih Chen |
| author_facet | Chun-Chieh Mo Dinh-Phuc Tran Jing-Ye Juang Chih Chen |
| author_sort | Chun-Chieh Mo |
| collection | DOAJ |
| description | In this study, the effect of intermetallic compound (IMC) bridging on the cracking resistance of microbumps with two different under bump metallization (UBM) systems, Cu/solder/Cu and Cu/solder/Ni, under a thermal cycling test (TCT) is investigated. The height of the Sn2.3Ag solders was ~10 µm, which resembles that of the most commonly used microbumps. We adjusted the reflow time to control the IMC bridging level. The samples with different bridging levels were tested under a TCT (−55–125 °C). After 1000 and 2000 TCT cycles (30 min/cycle), the samples were then polished and characterized using a scanning electron microscope (SEM). Before IMC bridging, various cracks in both systems were observed at the IMC/solder interfaces after the 1000-cycle tests. The cracks propagated as cyclic shapes from the sides to the center and became more severe as the thermal cycle was increased. With IMC bridging, we could not observe any further failure in all the samples even when the thermal cycle was up to 2000. We discovered that IMC bridging effectively suppressed crack formation in microbumps under TCTs. |
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| id | doaj.art-66405bac96404dde8137fbca7b4b80c5 |
| institution | Directory Open Access Journal |
| issn | 2075-4701 |
| language | English |
| last_indexed | 2024-03-10T09:32:24Z |
| publishDate | 2021-07-01 |
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| series | Metals |
| spelling | doaj.art-66405bac96404dde8137fbca7b4b80c52023-11-22T04:23:14ZengMDPI AGMetals2075-47012021-07-01117106510.3390/met11071065Effect of Intermetallic Compound Bridging on the Cracking Resistance of Sn2.3Ag Microbumps with Different UBM Structures under Thermal CyclingChun-Chieh Mo0Dinh-Phuc Tran1Jing-Ye Juang2Chih Chen3Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, TaiwanDepartment of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, TaiwanDepartment of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, TaiwanDepartment of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, TaiwanIn this study, the effect of intermetallic compound (IMC) bridging on the cracking resistance of microbumps with two different under bump metallization (UBM) systems, Cu/solder/Cu and Cu/solder/Ni, under a thermal cycling test (TCT) is investigated. The height of the Sn2.3Ag solders was ~10 µm, which resembles that of the most commonly used microbumps. We adjusted the reflow time to control the IMC bridging level. The samples with different bridging levels were tested under a TCT (−55–125 °C). After 1000 and 2000 TCT cycles (30 min/cycle), the samples were then polished and characterized using a scanning electron microscope (SEM). Before IMC bridging, various cracks in both systems were observed at the IMC/solder interfaces after the 1000-cycle tests. The cracks propagated as cyclic shapes from the sides to the center and became more severe as the thermal cycle was increased. With IMC bridging, we could not observe any further failure in all the samples even when the thermal cycle was up to 2000. We discovered that IMC bridging effectively suppressed crack formation in microbumps under TCTs.https://www.mdpi.com/2075-4701/11/7/1065thermal cyclingmicrobumpintermetallic compound3D-IC packaging |
| spellingShingle | Chun-Chieh Mo Dinh-Phuc Tran Jing-Ye Juang Chih Chen Effect of Intermetallic Compound Bridging on the Cracking Resistance of Sn2.3Ag Microbumps with Different UBM Structures under Thermal Cycling Metals thermal cycling microbump intermetallic compound 3D-IC packaging |
| title | Effect of Intermetallic Compound Bridging on the Cracking Resistance of Sn2.3Ag Microbumps with Different UBM Structures under Thermal Cycling |
| title_full | Effect of Intermetallic Compound Bridging on the Cracking Resistance of Sn2.3Ag Microbumps with Different UBM Structures under Thermal Cycling |
| title_fullStr | Effect of Intermetallic Compound Bridging on the Cracking Resistance of Sn2.3Ag Microbumps with Different UBM Structures under Thermal Cycling |
| title_full_unstemmed | Effect of Intermetallic Compound Bridging on the Cracking Resistance of Sn2.3Ag Microbumps with Different UBM Structures under Thermal Cycling |
| title_short | Effect of Intermetallic Compound Bridging on the Cracking Resistance of Sn2.3Ag Microbumps with Different UBM Structures under Thermal Cycling |
| title_sort | effect of intermetallic compound bridging on the cracking resistance of sn2 3ag microbumps with different ubm structures under thermal cycling |
| topic | thermal cycling microbump intermetallic compound 3D-IC packaging |
| url | https://www.mdpi.com/2075-4701/11/7/1065 |
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