Recent Advances in Preparation, Mechanisms, and Applications of Thermally Conductive Polymer Composites: A Review
At present, the rapid accumulation of heat and the heat dissipation of electronic equipment and related components are important reasons that restrict the miniaturization, high integration, and high power of electronic equipment. It seriously affects the performance and life of electronic devices. H...
Main Authors: | , , , , , , , , |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2020-11-01
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Series: | Journal of Composites Science |
Subjects: | |
Online Access: | https://www.mdpi.com/2504-477X/4/4/180 |