Recent Advances in Preparation, Mechanisms, and Applications of Thermally Conductive Polymer Composites: A Review

Recent Advances in Preparation, Mechanisms, and Applications of Thermally Conductive Polymer Composites: A Review

At present, the rapid accumulation of heat and the heat dissipation of electronic equipment and related components are important reasons that restrict the miniaturization, high integration, and high power of electronic equipment. It seriously affects the performance and life of electronic devices. H...

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Bibliographic Details
Main Authors: Hao Zhang, Xiaowen Zhang, Zhou Fang, Yao Huang, Hong Xu, Ying Liu, Daming Wu, Jian Zhuang, Jingyao Sun
Format: Article
Language:English
Published: MDPI AG 2020-11-01
Series:Journal of Composites Science
Subjects:
thermal conductivity
polymer composites
conductive network
thermal management
Online Access:https://www.mdpi.com/2504-477X/4/4/180

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